Artsey Ergo

Table of contents

• Renders
  • Render Angled
  • Render Top
  • Render Bottom
• Schematic
  • Monochrome
  • Light
• Assembly
  • Gerber viewer on tracespace.io
  • Interactive BOM
  • BOM
• Downloads
  • JLCPCB
  • Panelized JLCPCB
  • 3D Step
• Report
  • ERC
  • DRC
• PCB
  • Important sizes
  • General stats

Renders

Render Angled

Render Top

Render Bottom

Schematic

Monochrome

• Schematic Monochrome PDF

Light

• Schematic Light PDF

Assembly

Gerber viewer on tracespace.io

JLCPCB Gerber

Panelized JLCPCB Gerber

Interactive BOM

Check component locations by hovering over a specific component. The visual elements might not be precise enough for pcb review but can be very useful since it’s possible to pan and zoom. Not all BOM columns are available here, for datasheet links see BOM below.

IBOM HTML

BOM

All components with Values, References, Sheetpath and Links to the datasheet.

BOM HTML

Downloads

JLCPCB

• JLCPCB Zip
• JLCPCB BOM CSV
• JLCPCB CPL CSV

Panelized JLCPCB

• Panelized JLCPCB Zip
• Panelized JLCPCB BOM CSV
• Panelized JLCPCB CPL CSV

3D Step

• 3D Step

Report

ERC

• Errors: 0
• Warnings: 0
• Link: HTML Report

DRC

• Errors: 0
• Warnings: 0
• Link: HTML Report

PCB

Board size: 94.0x57.8 mm (3.7x2.28 inches)

• This is the size of the rectangle that contains the board
• Thickness: 1.6 mm (63 mils)
• Material: FR4
• Finish: ENIG
• Layers: 2
• Copper thickness: 35 µm

Solder mask: TOP / BOTTOM

• Color: Blue

Silk screen: TOP / BOTTOM

• Color: White

Stackup:

Name	Type	Color	Thickness [µm]	Material	Er	Loss tan
F.SilkS	Top Silk Screen	White		Direct Printing
F.Paste	Top Solder Paste
F.Mask	Top Solder Mask	Blue	10	Liquid Ink	3.3	0.000
F.Cu	copper		35
dielectric 1	core	FR4 natural	1510	FR4	4.5	0.020
B.Cu	copper		35
B.Mask	Bottom Solder Mask	Blue	10	Liquid Ink	3.3	0.000
B.Paste	Bottom Solder Paste
B.SilkS	Bottom Silk Screen	White		Direct Printing

Important sizes

Clearance: 0.2 mm (8 mils)

Track width: 0.2 mm (8 mils)

• By design rules: 0.0 mm (0 mils)

Drill: 0.4 mm (16 mils)

• Vias: 0.4 mm (16 mils) [Design: 0.4 mm (16 mils)]
• Pads: 0.5 mm (20 mils)
• The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH)

Via: 0.6/0.3 mm (24/12 mils)

• By design rules: 0.5/0.3 mm (20/12 mils)
• Micro via: yes [0.2/0.1 mm (8/4 mils)]
• Buried/blind via: yes
• Total: 154 (thru: 154 buried/blind: 0 micro: 0)

Outer Annular Ring: 0.1 mm (4 mils)

• By design rules: 0.1 mm (4 mils)

Eurocircuits class: 8C

• Using min drill 0.4 mm for an OAR of 0.1 mm

General stats

Components count: (SMD/THT)

• Top: 1/2 (SMD + THT)
• Bottom: 10/9 (SMD + THT)

Defined tracks:

Used tracks:

• 0.2 mm (8 mils) (215) defined: no
• 0.3 mm (12 mils) (185) defined: no
• 0.4 mm (16 mils) (4) defined: no
• 0.5 mm (20 mils) (41) defined: no

Defined vias:

Used vias:

• 0.6/0.3 mm (24/12 mils) (Count: 154, Aspect: 2.7 A) defined: no

Holes (excluding vias):

• 0.4 mm (16 mils) (12)
• 0.75 mm (30 mils) (4)
• 0.9 mm (35 mils) (2)
• 1.0 mm (39 mils) (28)
• 1.9 mm (75 mils) (16)
• 3.0 mm (118 mils) (24)
• 3.4 mm (134 mils) (8)
• 5.0 mm (197 mils) (2)

Oval holes:

• 1.5x2.5 mm (59x98 mils) (2)
• 1.5x5.0 mm (59x197 mils) (2)

Drill tools (including vias and computing adjusts and rounding):

• 0.4 mm (16 mils) (154)
• 0.5 mm (20 mils) (12)
• 0.75 mm (30 mils) (2)
• 0.85 mm (33 mils) (2)
• 0.9 mm (35 mils) (2)
• 1.1 mm (43 mils) (28)
• 1.5 mm (59 mils) (4)
• 2.0 mm (79 mils) (16)
• 3.1 mm (122 mils) (24)
• 3.5 mm (138 mils) (8)
• 5.0 mm (197 mils) (2)

Solder paste stats:

Using a paste with 87.75 % alloy, that has an specific gravity for the alloy of 7.4 g/cm³ and 1.0 g/cm³ for the flux. This paste has an specific gravity of 4.15 g/cm³.

The stencil thickness is 0.12 mm.

Side	Pads with paste	Area [mm²]	Paste [g]
Top	95	178.40	0.89
Bottom	95	178.40	0.89
Total	190	356.79	1.78

Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren’t computed.